Microfluidic system with single drive signal for multiple nozzles

ABSTRACT

A microfluidic die is disclosed that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.

BACKGROUND

Technical Field

The present disclosure is directed to a microfluidic system configuredto eject fluids from a plurality of nozzles driven in groups, where eachnozzle of one group is driven with a single drive signal.

Description of the Related Art

Microfluidic systems include a variety of ejection techniques that causefluid to exit nozzles of a die. These techniques includes thermal,piezo, and ultrasonic, to name a few. One example is thermal inkjetprint heads, which have precise nozzle control to deliver a drop of inkonto a piece of paper in a very precise location. In order to achievethis precision, control of each nozzle is associated with a single,dedicated electrical connection.

Many of these systems have such dedicated external electricalconnections for each nozzle in the die, such that if there are Nnozzles, there are N+1 external electrical connections. The extraconnection being coupled to ground. The external electrical connectionsmay be a flexible conduit of wires that couple to bond pads of the die.These systems also often have a dedicated internal electrical connectionon the die for each nozzle, each internal electrical connection beingcoupled to one of the bond pads of the die. These arrangements can bereferred to as the direct drive of each nozzle. These die tend to belarge because of the number of bond pads and internal electricalconnections utilized.

More complicated ejection systems include rows and columns of nozzlesthat are controlled by active circuitry formed in the same substrate asthe nozzles. The active circuitry could include NMOS transistors thatmultiplex the rows and columns to allow for more nozzles to becontrolled by a single one of the bond pads.

Further involved systems integrate CMOS based logic to create clocksystems to change the bond pad to nozzle ratio for each die. In order toform the CMOS based logic on the die, the die becomes extremelycomplicated and costly to manufacture. Layers upon layers of thin filmsare added to modify the bond pad to nozzle ratio.

BRIEF SUMMARY

The present disclosure is directed to a microfluidic delivery systemthat is configured to eject a fluid from multiple nozzles with a singledrive signal. The die may have groups of heaters coupled to a singlecontact pad such that each heater of the group receives the same drivesignal. Alternatively, each heater may have a separate contact pad onthe die, where groups of the contact pads are coupled to a single signalline on a printed circuit board or a flexible interconnect. In thisarrangement the group of contacts will drive their respective heaterssimultaneously.

This direct drive system of multiple nozzles ejecting fluidsimultaneously creates simplicity in the arrangement of electricaltraces on the die, on the circuit board, or on both. This can reducecost while reducing the overall footprint of the microfluidic deliverysystem.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

In the drawings, identical reference numbers identify similar elements.The sizes and relative positions of elements in the drawings are notnecessarily drawn to scale.

FIG. 1 is a schematic isometric view of a microfluidic delivery systemin accordance with one embodiment.

FIGS. 2A-2B are schematic isometric views of a microfluidic refillcartridge and a holder of the microfluidic system of FIG. 1.

FIG. 3 is a cross-section schematic view of line 3-3 in FIG. 2A.

FIG. 4 is a cross-section schematic view of line 4-4 in FIG. 2B.

FIGS. 5A-5B are schematic isometric views of a microfluidic deliverymember in accordance with an embodiment.

FIG. 5C is an exploded view of FIG. 5A.

FIGS. 6A-6C are schematic isometric views of a microfluidic die atvarious layers in accordance with another embodiment.

FIG. 7A is a cross-section view of line 7-7 in FIG. 6A.

FIG. 7B is an enlarged view of a portion of FIG. 7A.

FIG. 8A is a cross-section view of line 8-8 in FIG. 6A.

FIG. 8B is an enlarged view of a portion of FIG. 8A.

FIG. 9A is a cross-section view of line 9A-9A in FIG. 6A.

FIG. 9B is a cross-section view of line 9B-9B in FIG. 6A.

FIG. 10 is a top down view of an alternative embodiment of a printedcircuit mounting system.

FIG. 11 is a top down view of an alternative embodiment of amicrofluidic delivery member.

FIG. 12 is a top down view of an alternative embodiment of amicrofluidic die according to an embodiment.

FIG. 13 is an enhanced cross-section view through a printed circuitboard according to an embodiment.

FIG. 14 is an enhanced top down view of a plurality of woven fibers inthe printed circuit board of FIG. 13.

FIG. 15 is a top down view of an alternative embodiment of amicrofluidic die according to an embodiment.

FIG. 16 is an alternative embodiment of a microfluidic die according tothe present disclosure.

DETAILED DESCRIPTION

In the following description, certain specific details are set forth inorder to provide a thorough understanding of various embodiments of thedisclosure. However, one skilled in the art will understand that thedisclosure may be practiced without these specific details. In otherinstances, well-known structures associated with electronic componentsand semiconductor fabrication have not been described in detail to avoidunnecessarily obscuring the descriptions of the embodiments of thepresent disclosure.

Unless the context requires otherwise, throughout the specification andclaims that follow, the word “comprise” and variations thereof, such as“comprises” and “comprising,” are to be construed in an open, inclusivesense, that is, as “including, but not limited to.”

Reference throughout this specification to “one embodiment” or “anembodiment” means that a particular feature, structure or characteristicdescribed in connection with the embodiment is included in at least oneembodiment. Thus, the appearances of the phrases “in one embodiment” or“in an embodiment” in various places throughout this specification arenot necessarily all referring to the same embodiment. Furthermore, theparticular features, structures, or characteristics may be combined inany suitable manner in one or more embodiments.

As used in this specification and the appended claims, the singularforms “a,” “an,” and “the” include plural referents unless the contentclearly dictates otherwise. It should also be noted that the term “or”is generally employed in its sense including “and/or” unless the contentclearly dictates otherwise.

As used in the specification and appended claims, the use of“correspond,” “corresponds,” and “corresponding” is intended to describea ratio of or a similarity between referenced objects. The use of“correspond” or one of its forms should not be construed to mean theexact shape or size.

In the drawings, identical reference numbers identify similar elementsor acts. The size and relative positions of elements in the drawings arenot necessarily drawn to scale.

FIG. 1 illustrates a microfluidic delivery system 10 formed inaccordance with one embodiment of the disclosure. The microfluidicdelivery system 10 is directed to ejecting any number of fluids in avertical or angled manner from a housing 12. The housing 12 has an uppersurface 14, a lower surface 16, and a body portion 18 between the upperand lower surfaces. The upper surface of the housing 12 includes a firsthole 20 that places an environment external to the housing 12 in fluidcommunication with an interior portion 22 of the housing 12. Theinterior portion 22 of the housing 12 includes a holder member 24 thatholds a removable microfluidic refill cartridge 26. As will be explainedbelow, the microfluidic delivery system 10 is configured to deliverfluid from within the microfluidic refill cartridge 26 to theenvironment external to the housing 12.

Access to the interior portion 22 of the housing is provided by anopening 28 in the body portion 18 of the housing 12, which can be closedby a cover or door 30 of the housing 12. The holder member 24 includesan upper surface 32 and a lower surface 34 that are coupled together byone or more sidewalls 36 and has an open side 38 through which themicrofluidic refill cartridge 26 can slide in and out. The upper surface32 of the holder member 24 includes a second hole 40 that is alignedwith the first hole 20 of the housing 12. The holder member 24 holds themicrofluidic refill cartridge 26 in position.

The housing 12 may include external electrical connection elements forcoupling with an external power source. The external electricalconnection elements may be a plug configured to be plugged into anelectrical outlet or battery terminals. Internal electrical connectionscouple the external electrical connection elements to the holder member24 to provide power to the microfluidic refill cartridge. The housing 12may include a power switch 42 on a front of the housing 12.

FIG. 2A shows the microfluidic refill cartridge 26 in the holder member24 without the housing 12, and FIG. 2B shows the microfluidic refillcartridge 26 removed from the holder member 24. A first circuit board 44is coupled to the upper surface 32 of the holder member by a screw 46.The first circuit board 44 includes electrical contacts 48 thatelectrically couple to the microfluidic refill cartridge 26. Theelectrical contacts 48 of the first circuit board 44 are in electricalcommunication with the internal and external electrical connectionelements.

The microfluidic refill cartridge 26 includes a reservoir 50 for holdinga fluid 52 (see FIG. 3). The reservoir 50 may be any shape, size, ormaterial configured to hold any number of different types of fluid. Thefluid held in the reservoir may be any liquid composition. In oneembodiment, the fluid is an oil, such as a scented oil. In anotherembodiment, the fluid is water. It may also be alcohol, a perfume, abiological material, a polymer for 3-D printing, or other fluid.

A lid 54, having an inner surface 56 and an outer surface 58, is securedto an upper portion 60 of the reservoir to cover the reservoir. The lid54 may be secured to the reservoir in a variety of ways known in theart. Between the lid 54 and the reservoir 50 there may be an o-ring 62for forming a seal to prevent fluid from flowing.

A microfluidic delivery member 64 is secured to an upper surface 66 ofthe lid 54 of the microfluidic refill cartridge 26. The microfluidicdelivery member 64 includes an upper surface 68 and a lower surface 70(see FIGS. 5A-5C). A first end 72 of the upper surface 68 includeselectrical contacts 74 for coupling with the electrical contacts 48 ofthe first circuit board 44 when placed in the holder member 24. A secondend 76 of the microfluidic delivery member 64 includes a part of a fluidpath that passes through an opening 78 for delivering fluid.

FIG. 3 is a cross-section view of the microfluidic refill cartridge 26in the holder member 24 along the line 3-3 shown in FIG. 2A. Inside thereservoir 50 is a fluid transport member 80 that has a first end 82 inthe fluid 52 in the reservoir 50 and a second end 84 that is above thefluid. The second end 84 of the transport member 80 is located below themicrofluidic delivery member 64. The fluid transport member 80 deliversfluid from the reservoir 50 to the microfluidic delivery member 64.

The fluid transport member 80 is configured to allow fluid in thereservoir 50 to travel from the first end 82 to the second end 84, suchas with capillary action against gravity. Fluid can travel by wicking,diffusion, suction, siphon, vacuum, or other mechanism. The fluidtransport member 80 may be in the form of fibers or sintered beads.

As best shown in FIG. 4, the second end 84 of the fluid transport member80 is surrounded by a transport cover 86 that extends from the innersurface of the lid 54. The second end 84 of the fluid transport member80 and the transport cover 86 form a chamber 88. The chamber 88 may besubstantially sealed between the transport cover 86 and the fluidtransport member 80 to prevent air from the reservoir 50 from enteringthe chamber 88.

Above the chamber 88 is a first through hole 90 in the lid 54 thatfluidly couples the chamber 88 above the second end 84 of the fluidtransport member 80 to the fluid path through the opening 78 of themicrofluidic delivery member 64. The microfluidic delivery member 64 issecured to the lid 54 above the first through hole 90 of the lid andreceives fluid.

As is shown in FIGS. 4 and 5A-5C, the microfluidic delivery member 64may include a printed circuit board 106 that carries a semiconductor die92. The printed circuit board 106 includes first and second circularopenings 136, 138 and an oval opening 140. Prongs 142 from the lid 54extend through the openings 136, 138, 140 to ensure the board 106 isaligned with the fluid path appropriately. The oval opening 140interacts with a wider prong so that the board 106 can only fit onto thelid 54 in one arrangement.

The upper and lower surfaces of the board may be coated with a soldermask 124 a, 124 b. Openings in the solder mask 124 may be provided wherecontact pads 112 of the die 92 are positioned on the circuit board 106or at the first end 72 where the contacts 74 are formed. The solder mask124 may be used as a protective layer to cover electrical traces 75carried by the board 106 that couple the contact pads 112 of the die 92to the electrical contacts 74, which couple the contact pads 112 to theexternal power source.

The printed circuit board 106 (PCB) is a rigid planar circuit board,having the upper and lower surfaces 68, 70. The circuit board 106includes one or more layers of insulative and conductive materials. Inone embodiment, the substrate 107 includes an FR4 PCB 106, a compositematerial composed of woven fiberglass with an epoxy resin binder that isflame resistant. In other embodiments, the substrate 107 includesceramic, glass or plastic. In an alternative embodiment, instead ofhaving a rigid circuit board, a flexible interconnect may be used tocouple the die to electrical connections in the housing.

As is further shown in FIGS. 13 and 14, an FR4 PCB 106 includes aplurality of bundles 118 of fibers 120 that are woven together. FIGS. 13and 14 are enhanced views of an FR4 PCB, such as the circuit board 106described above. Some of the bundles 118, such as bundle 118 a andbundle 118 b, are adjacent to each other and extend in and out of FIG.13. Other bundles, such as bundle 118 c, are transverse to bundles 118 aand 118 b and extend left to right in FIG. 13. Each bundle alternatesover and under adjacent transverse bundles. For example, bundle 118 c isover bundle 118 d, under bundle 118 a, over bundle 118 b, and underbundle 118 e.

Each bundle 118 includes a plurality of fibers 120 or strands offlexible resilient material. In one embodiment, the fibers 120 areelongated fiberglass strands. FIG. 13 shows eleven fibers 120 perbundle; however, the number of fibers 120 is illustrative and any numberof fibers 120 may be utilized to achieve the PCB 106.

The bundles 118 are encased in a support material 122 that makes thecomposite material circuit board 106 rigid enough to support the die 92.The support material 122 may be a polymer or other material sufficientto bind the fibers 120 of the bundles 118 in the woven pattern. Thesupport material 122 may be applied to the fiber bundles 118 in a liquidform so that the support material fills in spaces between the wovenbundles. Alternatively, the woven bundles 118 of fibers 120 are placedbetween two polymer sheets and heated to form the support material. Inone embodiment, the heat causes the polymer sheets to flow between thefibers 120 and bond to each other to form the support material 122. Inanother embodiment, the polymer sheets form a laminate of the supportmaterial over the bundles of fibers. Once solidified, the supportmaterial 122 is not brittle, which minimizes the risk of cracking duringthe packaging.

FIG. 14 is a top down view of the woven fibers 120 of the circuit board106 arranged in the plurality of bundles 118. The over and under wovenpattern forms a strong yet flexible material for supporting the die 92and for simplifying the electrical connection to the external powersource.

In one embodiment, the fibers 120 are flame resistant woven fiberglasscloth and the support material is a flame resistant epoxy resin binder;for example, an FR-4 grade reinforced glass epoxy laminate sheet havingthe woven bundles of fibers. FR-4 grade is a high-pressure thermosetplastic laminate with good mechanical strength to weight ratios thatmaintains its mechanical qualities in dry and humid conditions.Fiberglass has high tensile strength with flexibility.

Returning to FIGS. 5A-5C, the fluid delivery system 64 is configured toprovide a single, easily accessible and removable circuit board 106. Inparticular, the circuit board 106 includes all electrical connections,the contacts 74, the traces 75, and the contact pads 112, on the uppersurface 68 of the board 106. For example, a top surface 144 of theelectrical contacts 74 that couple to the housing are parallel to an x-yplane. The upper surface 68 of the board 106 is also parallel to the x-yplane. In addition, a top surface 146 of a nozzle plate 132 of the die92 is also parallel to the x-y plane. The contact pads 112 also have atop surface that is parallel to the x-y plane. By forming each of thesefeatures to be in parallel planes, the complexity of the board 106 isreduced and it is easier to manufacture. In addition, this allowsnozzles 130 to eject the fluid vertically (directly up or at an angle)away from the housing, such as could be used for spraying scented oilsinto a room as air freshener. This arrangement could create a scentedplume 5-10 cm high.

On the lower surface of the board, the filter 96 may be provided toseparate the opening 78 of the board 106 from the chamber 88 at thelower surface of the PCB. The filter 96 is configured to prevent atleast some of the particles from passing through the opening to preventclogging of the nozzles 130 of the die 92. The filter 96 is attached tothe bottom surface with the adhesive material 98. The adhesive material98 may be an adhesive material that does not readily dissolve by thefluid in the reservoir 50. Alternatively, the adhesive material 98 maybe a first mechanical spacer 98.

The semiconductor die 92 is secured to the upper surface of the boardabove the opening 78 by any adhesive material. The adhesive material maybe the same or different from the adhesive material used to secure thefilter 96 to the microfluidic delivery member 64.

The opening 78 may be formed as an oval, as is illustrated in FIG. 5c ;however, other shapes are contemplated depending on the application. Theopening 78 exposes sidewalls 102 of the board 106. If the board 106 isan FR4 PCB, the bundles of fibers would be exposed by the opening. Thesesidewalls are susceptible to fluid, and thus a liner 100 is included tocover and protect the sidewalls. If fluid enters the sidewalls, theboard could begin to deteriorate, cutting short the life span of thisproduct.

The liner 100 is configured to protect the board from all fluids that anend user may select to eject through the die 92. For example, if the die92 is used to eject scented oils from the housing, the liner 100 isconfigured to protect the sidewalls of the board 106 from any damagethat could be caused by the scented oils. The liner 100 prolongs thelife of the board 106 so that an end user can reuse the housing and thedie 92 again and again with refillable or replaceable fluid cartridges.

These oils have different chemical properties than typical ink used withinkjet printers. Accordingly, the prior inkjet print heads used veryexpensive, very specific materials to prevent the ink from damaging thecomponents that support the ink ejection process, such as the reservoir50. In the present disclosure, common materials, such as an FR4 board,can be utilized to create a sophisticated, but cost effective system.The liner 100 provides a protective coating to allow the cost effectiveFR4 board to be utilized in this system. In one embodiment, the liner isgold, however, in other embodiments the liner may be silicon nitride,other oxides, silicon carbide, or other metals, such as tantalum oraluminum.

The liner 100 in FIGS. 4 and 5C includes a vertical member that isadhered to the sidewall 102. In other embodiments, the liner may includetop and bottom extensions that overlap the upper and lower surfaces ofthe board, such that the liner includes corners that wrap around theexposed corners formed by the sidewalls and the opening. In oneembodiment, the liner is a metal material, such as gold. In otherembodiments, the liner is an inert material, which is less likely tointeract with a fluid selected for use in the cartridge.

A second mechanical spacer 104 separates a bottom surface 108 of the die92 from the upper surface 68 of the printed circuit board 106. Anencapsulant 116 covers the contact pads 112 and leads 110, while leavinga central portion 114 of the die exposed.

FIGS. 6A-6C include more details of the microfluidic die 92. Themicrofluidic die 92 includes a substrate 107, a plurality ofintermediate layers 109, and a nozzle plate 132. The plurality ofintermediate layers 109 include dielectric layers and a chamber layer148 that are positioned between the substrate and the nozzle plate.

The die 92 includes a plurality of electrical connection leads 110 thatextend from one of the intermediate dielectric layers 109 down to thecontact pads 112 on the circuit board 106. Each lead 110 couples to asingle contact pad 112 on the circuit board and to a single contact pad152 on the die. Openings 150 on the left and right side of the dieprovide access to the intermediate layers 109 to which the leads arecoupled. The openings 150 pass through the nozzle plate 132 and thechamber layer 148 to expose the contact pads 152 that are formed on theintermediate dielectric layers. In other embodiments that will bedescribed below, there may be one opening 150 positioned on only oneside of the die, such that all of the leads that extend from the dieextend from one side while other side remains unencumbered by the leads.

In the illustrated embodiment, there are eighteen nozzles 130 throughthe nozzle plate 132, and nine nozzles on each side of a center line.FIG. 6B is a top down isometric view of the die 92 with the nozzle plate132 removed, such that the chamber layer 148 is exposed. In someembodiments, the nozzle has a diameter between 20-30 microns. Eachnozzle is in fluid communication with the fluid in the reservoir 50 by afluid path that includes the first end 82 of the fluid transport member80, through the transport member 80 to the second end 84, the chamber 88above the second end 84 of the transport member, the first through hole90 of the lid 54, the opening 78 of the PCB, through an inlet 94 of thedie 92, then through a channel 126, and to the chamber 128, and out ofthe nozzle 130 of the die.

The die 92 includes an inlet path 94 that passes completely through thesubstrate 107 and interacts with the chamber layer 148 and the nozzleplate 132. The inlet path 94 is a rectangular opening; however, othershapes may be utilized according to the flow path constraints. The inletpath 94 is in fluid communication with the fluid path that passesthrough the opening 78 of the board 106 (see FIG. 4).

The inlet path 94 is coupled to a channel 126 (see FIGS. 7A-7B) that isin fluid communication with individual chambers 128, forming the fluidpath. Above the chambers 128 is the nozzle plate 132 that includes theplurality of nozzles 130. Each nozzle 130 is above a respective one ofthe chambers 128. The die 92 may have any number of chambers andnozzles, including one chamber and nozzle. In the illustratedembodiment, the die includes eighteen chambers each associated with arespective nozzle. Alternatively, it can have ten nozzles and twochambers providing fluid for a group of five nozzles. It is notnecessary to have a one-to-one correspondence between the chambers andnozzles.

Proximate each nozzle chamber is a heating element 134 (see FIGS. 6C and8B) that is electrically coupled to and activated by an electricalsignal being provided by one of the contact pads 152 of the die 92. Eachheating element 134 is coupled to a first contact 154 and a secondcontact 156. The first contact 154 is coupled to a respective one of thecontact pads 152 on the die by a conductive trace 155. The secondcontact 156 is coupled to a ground line 158 that is shared with each ofthe second contacts 156 on one side of the die. In one embodiment, thereis only a single ground line that is shared by contacts on both sides ofthe die. Although FIG. 6C is illustrated as though all of the featuresare on a single layer, they may be formed on several stacked layers ofdielectric and conductive material.

In use, when the fluid in each of the chambers 128 is heated by theheating element 134, the fluid vaporizes to create a bubble. Theexpansion that creates the bubble causes fluid to eject from the nozzle130 and to form a droplet.

Returning to FIG. 5C, the traces 75 are coupled between the contact pads112 and the contacts 74. In this embodiment, there are twenty contactpads, ten on each side of the die 92. Each contact pad 112 is coupled toone lead 110, which couples to one contact pad 152 on the die. There areeighteen nozzles in this die, which corresponds to eighteen heaters 134.Each heater is directly driven by one contact pad 152; however, severalcontact pads 112 are grouped together and driven simultaneously. Inparticular, there are three groups of three contact pads 112 on eachside of the die 92. Each group of contact pads 112 is driven with asingle trace 75. For example, contact 74 a is coupled to group 112 a,which will drive three heaters 134 a (see FIG. 6C).

In this embodiment, there is a ground line 77 a, 77 b associated witheach side of the die 92. Although there are two separate contacts 74 b,74 c coupled to each ground line 77 a, 77 b, respectively, these twocontacts could be a single contact. The total number of contacts 74could be reduced to seven. It is to be understood that any number ofnozzles and heaters could be driven together based on the voltagelimitations of the system. As will be discussed in more detail below,dimensions of the board can be significantly reduced by reducing thenumber of contacts 74 that are included.

Having a contact 74 for each contact pad 112 consumes a large area onthe circuit board 64. By driving several contact pads 112 in parallel,the number of traces 75 on the board 64 is reduced. This can allow theboard to be manufactured to have a significantly smaller footprint.

In an alternative embodiment, the leads 110 extending from the die 92may extend from a smaller side 93 of the die. The contact pads 112 wouldthen be positioned between the opening 78 and the contacts 74. Thetraces that couple the contact pads 112 to the contacts 74 would thenuse less material and could allow the board to have a smaller width.

FIG. 7A is a cross-section view through the die of FIG. 6A, through cutlines 7-7. As mentioned above, the substrate 107 includes the inlet path94 through a center region associated with the chambers 128 and thenozzles 130. The inlet path is configured to allow fluid to flow up fromthe bottom surface 108 of the die into the channels, which couple to thenozzle chambers and heat the fluid to be ejected out of the nozzles.

The chamber layer 148 defines angled funnel paths 160 that feed thefluid from the channel 126 into the chamber 128. The chamber layer 148is positioned on top of the intermediate dielectric layers 109. Thechamber layer defines the boundaries of the channels and the pluralityof chambers associated with each nozzle. In one embodiment, the chamberlayer is formed separately in a mold and then attached to the substrate.In other embodiments, the chamber layer is formed by depositing,masking, and etching layers on top of the substrate.

The intermediate layers 109 include a first dielectric layer 162 and asecond dielectric layer 164. The first and second dielectric layers arebetween the nozzle plate and the substrate. The first dielectric layer162 covers the plurality of first and second contacts 154, 156 formed onthe substrate, and covers the heaters 134 associated with each chamber.The second dielectric layer 164 covers the conductive traces 155.

FIG. 7B is an enhanced view of a region of FIG. 7A. This enhanced viewincludes four nozzles formed in the nozzle plate, which are associatedwith four chambers positioned under each nozzle. The channel feeds fluidinto each chamber through the funnel path.

FIG. 8A is a cross-section view through the die along the cut line 8-8of FIG. 6A. This cross-section is perpendicular to the cross-section ofFIG. 7A. The inlet can be seen extending from the bottom surface of thedie up to the channel. The inlet, as described above, allows fluid toflow from an external device, such as the cartridge described above. Theinlet is in fluid communication with the channels and with the chambers,which are configured to eject the fluid through the nozzles in use. FIG.8B is an enhanced cross-sectional view of a region of FIG. 8A. In thisview, the heaters formed on the substrate are positioned below thechambers.

FIG. 9A is a cross-section view through the die along the cut line 9A-9Ain FIG. 6A. The first and second contacts 154, 156 are formed on thesubstrate 107. The heaters 134 are formed to overlap with the first andsecond contacts 154, 156 of a respective heater assembly. The contacts154, 156 may be formed of a first metal layer or other conductivematerial. The heaters 134 may be formed of a second metal layer or otherconductive material. The heaters 134 are thin film resistors thatlaterally connect the first and second contacts 154, 156. In otherembodiments, instead of being formed directly on a top surface of thecontacts, the heaters may be coupled to the contacts through vias or maybe formed below the contacts.

In one embodiment, the heater is a 20-nanometer thick tantalum aluminumlayer. In another embodiment, the heater may include chromium siliconfilms, each having different percentages of chromium and silicon andeach being 10 nanometers thick. Other materials for the heaters mayinclude tantalum silicon nitride and tungsten silicon nitride. Theheaters may also include a 30-nanometer cap of silicon nitride. In analternative embodiment, the heaters may be formed by depositing multiplethin film layers in succession. A stack of thin film layers combine theelementary properties of the individual layers.

As shown in FIG. 6C, the contacts extend from the heaters 134 out to thetraces 155. The first contact 154 provides power, while the secondcontact 156 is coupled to ground 158. As noted above, each of theheaters 134 on one side of the die are coupled to the same ground line158. Alternatively, each of the heaters 134 on the die may be coupled toa single ground line to reduce the number of contact pads 152 on thedie.

The first dielectric layer 162 covers the heaters and the contacts andthe second dielectric layer 164 covers the first dielectric layer 162.The second dielectric layer 164 forms a bottom surface of the chamber128. The thickness of the second dielectric layer 164 may be quite smallto reduce a distance between the heater 134 and the chamber.

FIG. 9B is a cross-section view through the die along the cut line 9B-9Bin FIG. 6A. A length of the first contact 154 can be seen adjacent tothe inlet 94. A via 151 couples the first contact 154 to trace 155 thatis formed on the first dielectric layer 162. The second dielectric layer164 is on the trace 155. A via 149 is formed through the seconddielectric layer 164 and couples the trace 155 to the contact pad 152. Aportion of the ground line 158 is visible toward an edge 163 of the die,between the via 149 and the edge 163.

As can be seen in this cross-section, the die 92 is relatively simpleand does not include complex integrated circuitry. This die 92 will becontrolled and driven by an external microcontroller or microprocessor.The external microcontroller or microprocessor may be provided in thehousing. This allows the board 64 and the die 92 to be simplified andcost effective.

This die 92 is a thermal heating die that is free of complicated activecircuitry. In this embodiment, there are two metal or conductive levelsformed on the substrate. These conductive levels include the contact 154and the trace 155. In some embodiments, all of these features can beformed on a single metal level. This allows the die to be simple tomanufacture and minimizes the number of layers of dielectric between theheater and the chamber.

FIG. 10 is directed to another embodiment of the present disclosure andincludes a printed circuit mounting system 300 for a thermal inkjet die302. The die could be other types of ejector die, such as piezoejection, ultrasonic ejection, and other mechanical ejection of a fluid.The mounting system includes a printed circuit board 304 formed of acomposite material, such as woven fibers or other suitable layeredmaterial. One example of the composite material is FR4, which includes aplurality of bundles of fibers (see FIGS. 13 and 14). FR4 is a cheap andeasily accessible material that can keep costs down so that themicrofluidic delivery system 64 can be utilized in a variety of newenvironments, such as for ejecting scented oils vertically from the die.They may also be used in the medical field to vaporize medicine for apatient to inhale. Using the proposed microfluidic delivery system asdescribed herein can give the patient or physician precise control overthe rate and time of the dosage. For example, the physician couldprogram the system 300 to vaporize the medicine for 20-second burstsspaced by 60 seconds without medicine for a period of time. Further, twoor more die can be mounted side-by-side to deliver two or more differenttypes of vapors to a patient using the same electronic controls.

The board 304 is a rigid material that provides consistent and reliablesupport for the die 320. The board 304 may alternatively be glass,silicon, or any other industry accepted standard circuit board. Theboard 304 includes a plurality of contact pads 306 on a top surface 308positioned near a first end 310. The die 302 is positioned near a secondend 312 that is opposite to the first end 310. There is a notch 314 inthe first end 310 that provides guidance for insertion of the board intothe housing and ensures it can only be inserted one way.

The die includes twelve nozzles 316 formed through nozzle plate. Thereare thirteen contact pads 306 that provide electrical control signals todictate when the die ejects fluid. The contact pads 306 couple to thedie through a plurality of traces 318 that are formed in the top surfaceof the board. Twelve of the contact pads 306 are connected to twelveheaters positioned underneath a chamber under each nozzle. Thethirteenth contact pad is coupled to ground. Each of the heaters sharethe same ground line. If all nozzles will always eject fluid together,the control pads 306 can be only two, one power and one ground, thatconnect in parallel to all heaters. Alternatively, there can be twopower pads 306 and two ground pads 306 that are electrically separatebut driven together to provide back-up or redundancy to increase thereliability. The nozzles 316 can also be connected and driven as twobanks.

An encapsulant 320 covers leads that extend from a layer of the die outto the surface of the board. In this embodiment, there is onlyencapsulant on one side of the die. It is beneficial to minimize theamount of encapsulant used because encapsulant can move around before itis cured into its final shape. If the encapsulant is too close to thenozzles, it can affect the performance of the nozzles. In order to havethe encapsulant on one side of the die, each of the electrical pathsthrough the die must be exposed from one side.

In one embodiment, the traces 318, the contact pads 306, and thecontacts from the leads of the die are all formed in the same plane onthe top surface of the board. In addition, the bottom surface of the diemay rest in the same plane such that the nozzles are in a plane parallelto the plane of the leads, contacts, and contact pads.

In one embodiment, the die 92 includes active circuitry includingtransistors, resistors, capacitors, and other features that areconfigured to drive the heaters and eject fluid out of the nozzles. Inother embodiments, the die 92 does not include any active circuitry andonly includes electrical connections to the heaters. This otherembodiment will be controlled and driven by a controller that is spacedfrom the die and is also spaced from the board 106.

FIG. 11 is an alternative embodiment of a microfluidic delivery member330. This delivery member is significantly smaller in length and widththan the board of FIG. 10. This smaller footprint allows the housing andlid to be smaller to utilize this technology in a variety of sizeconstrained environments.

This decrease in size is related to arranging groups of nozzles to bedriven in parallel. For example, in this embodiment there are twelvenozzles 332 on a die 334. The die is coupled to a first end 335 of aboard 336 that includes five contacts 340 at a second end of the board337. The five contacts are coupled to the die 334 through a plurality oftraces 342 a-342 e.

The five contacts include four power delivering contacts 340 a, 340 b,340 c, 340 d and one ground contact 340 e. The power delivering contacts340 a, 340 b, 340 c, 340 d each provide the same voltage, but providepulses at different times. A controller that is not coupled to the boardprovides the pulses and controls when each nozzle ejects fluid.

Since there are four power delivering contacts 340 a, 340 b, 340 c, 340d, the nozzles are broken into four groups of three. Each group of threewill fire simultaneously, such that each heater associated with eachnozzle of the group of three nozzles will receive power at the same timeand heat the fluid simultaneously.

The controller may fire each group of three consecutively so that amaximum amount of current can be sent to each group. This also allowsthe chambers of a recently fired group to refill and be ready to ejectwhen the pulse returns to that group of three nozzles. In oneembodiment, the controller will output a two-microsecond pulse to afirst one of the power delivering contacts 340 a. Then, the controllerwill output a two-microsecond pulse to a second one of the powerdelivering contacts 340 b, and so forth, until the controller returns tothe first one of the power delivering contacts 340 a. This configurationwill eject three drops for every two-microsecond pulse. The number ofnozzles that can be driven in parallel can vary and is limited by thepower supply of the system.

FIG. 12 is a top down view of an alternative embodiment of a die 400according to the present disclosure. This die 400 is incomplete in thatthe chambers and the nozzles have not been illustrated. The chambers andnozzles described in detail with respect to FIGS. 6A-6C, 7A-7B, and8A-8B may be used with this die 400.

The die includes a plurality of heaters 402. Each heater includes aninput contact 404 and an output contact 406. Each output contact 406 iscoupled to a single ground line 408. In one embodiment, the input andoutput contacts 406 are formed as part of a same metal or conductivelevel as the single ground line 408; however, in other embodiments, theinput and output contacts 406 are formed as part of a different metal orconductive level as the single ground line 408.

In this embodiment, there are twenty heaters, which are configured toheat twenty different chambers and eject fluid from twenty nozzles. Thetwenty heaters are grouped in to groups of five heaters that are alldriven by a single signal from a single line. For example, there arefour groups 410 a, 410 b, 410 c, 410 d of five heaters 402. There arefour signal lines 412 a, 412 b, 412 c, 412 d each coupled to one of thefour groups 410 a, 410 b, 410 c, 410 d of heaters. The single groundline may be supplied with a positive voltage while the other four signallines 412 a, 412 b, 412 c, 412 d receive a lower voltage.

Each of the signal lines 412 a, 412 b, 412 c, 412 d is coupled to aseparate contact pad 414 a, 414 b, 414 c, 414 d, which is coupled to anexternal power source. The single ground line 408 is coupled to anothercontact pad 416. A via (not shown) may couple the single ground line 408to the contact pad 416. A plurality of different vias (not shown) maycouple the four signal lines 412 a, 412 b, 412 c, 412 d to the inputcontacts 404.

These twenty nozzles are driven by five contact pads, one of which isground. This greatly simplifies the manufacturing steps to form thisdie, which can reduce cost and the overall footprint of the die. Inaddition, five drops are formed from five chambers at the same time. Itis to be noted that the number of heaters that are driven together canvary based on the demands of the system in which the die is installed.Ejecting multiple drops at the same time can enhance the plume createdby the vertically oriented nozzles.

In some embodiments, this system may be configured to eject a fluid thathas been mixed with ethanol or some other volatile additive. The ethanolhelps each drop to evaporate as it moves vertically away from the dieonce ejected. This also prevents the fluid from falling back on to a topsurface of the die and clogging the nozzles. If the ethanol is mixedwith a scented oil, the scented oil is released into the air when theethanol evaporates. By ejecting multiple drops at the same time, theevaporation of the drops can extend a height of a plume formed from thedrops. A single ejected drop will have a much smaller plume than aplurality of drops ejected together. The ethanol increases the vaporpressure, which in turn creates a more powerful ejection.

In this disclosure, nozzles can be ganged together in parallel such thatan individual electrical pulse through a set of bond pads will firemultiple nozzles concurrently. This increases the current load of adrive system and eliminates discrete nozzle control. Decreasing thenumber of bond pads allows the die size and substrate size to decrease,reducing cost. In the preferred embodiment, five nozzles are gangedtogether for simultaneous firing. If there are twenty total nozzles withfive nozzles grouped together, only five bond pads, one ground and foursignal lines are utilized. This can result in a die size reduction of50%. The reduction of bond pads means a reduction in theelectro-mechanical interconnect on an associated board, whichcorresponds to a reduction in the cost of a connector that couples theboard to the housing.

In one embodiment, each heater will use around 150-200 milliamp. Thecurrent for five heaters may be around 750 milliamp −1 amp. These groupsof five heaters may be fired in sequence at 5 khz per group.

FIG. 15 is yet another embodiment of a portion of a die 500 formed inaccordance with the present disclosure. This die 500 includes a singlemetal or conductive level from which all electrical components of aheating system 502 are formed. The heating system 502 is formed on asubstrate 504. There is an inlet path 506 through the substrate 504 thatis configured to allow fluid to flow from a reservoir up to chambersformed above the substrate. The chambers are not shown in thisembodiment. Chambers similar to the chambers described above may beutilized with this die 500.

The heating system 502 also includes a plurality of heaters 508. Anozzle 510 is shown positioned centrally with respect to the heater;however, the nozzles is simply a reference of the nozzle position. Theactual nozzles are not shown because no nozzle plate is included in thisview. The nozzle plate has been omitted so that the single metal levelis visible without overlapping features from the chambers and nozzles.

Each heater 508 includes an input contact 512 and an output contact 514.All of the output contacts 514 are coupled together and are coupled to asingle ground trace 516. The single ground trace 516 is positionedbetween the heaters 508 and the inlet path 506. The ground trace 516extends along a first edge 518 of the die.

The plurality of heaters are driven in groups of five such that thereare four input traces 520 a, 520 b, 520 c, 520 d. The input traces 520 cand 520 d extend along a second edge 522 of the die.

In one embodiment, the ground trace 516 may be positioned directly underthe funnel paths 160 that feed the chamber. There may be an extendedflow path between the funnel path and the chamber. For example, in FIG.6B, the narrow portion between the funnel path and the chamber may beelongated and the ground trace may pass beneath the narrow portion. Alength of the ground trace is perpendicular to a length of the narrowportion.

FIG. 16 is an alternative embodiment of a microfluidic die 600 thatincludes an inlet path 602 that is configured to move fluid from areservoir to a plurality of chambers 604. A plurality of heaters 606 arepositioned adjacent to a bottom surface of the chamber 604 to heat thefluid and eject the fluid from the chamber. This die is configured to beused with any number of fluids that may be selected by a user. The dieis configured to eject fluid vertically, such that it may be utilized toeject a scented fluid or a medication.

The fluid moves through the inlet path 602 to a channel region 612,through a funnel region 614, into a narrow flow path 616, and then intothe chamber 604. The flow path 616 is narrower in width than the chamberand narrower than a widest part of the funnel region 614.

Each of the heaters 606 are coupled to power lines 608 and a ground line610. Each of the heaters 606 share the same ground line 610, whichoverlaps the narrow flow path 616 that leads to the chambers. In thisembodiment, there is one contact 618 for ground. There are ten powercontacts 620. There are twenty heaters 606, which are each associatedwith a nozzle (not shown). Each heater is paired with an adjacent heaterand coupled to one of the power lines 608. This way pairs of heaters aredriven at the same time by a single power contact 620. In an alternativeembodiment, the uncoupled contact pad may be a second ground contact.

This die may be coupled to a circuit board, such as the boards describedabove. It is possible that two of the power contacts 620, and thus fourheaters, may be coupled to a single contacts pad of the board.Accordingly, four heaters would be driven at the same time and fourdrops would be ejected at the same time.

A thermal sense resistor (TSR) 622 may be included around an edge of thedie 600 and may be coupled to a pair of contact pads 624. The TSR ismeasured to calculate the temperature of the die. The thermal senseresistor may use a common ground with the rest of the die, however, thatcreates more noise on the signal that is sensed. The sense resistor isread between firing pulses so there is no overlap of signals. The senseresistor is generally run as a serpentine to increase the number ofsquares and therefore increase the sensitivity of the measurement.

The various embodiments described above can be combined to providefurther embodiments. All of the U.S. patents, U.S. patent applicationpublications, U.S. patent applications, foreign patents, foreign patentapplications and non-patent publications referred to in thisspecification and/or listed in the Application Data Sheet areincorporated herein by reference, in their entirety. Aspects of theembodiments can be modified, if necessary to employ concepts of thevarious patents, applications and publications to provide yet furtherembodiments.

These and other changes can be made to the embodiments in light of theabove-detailed description. In general, in the following claims, theterms used should not be construed to limit the claims to the specificembodiments disclosed in the specification and the claims, but should beconstrued to include all possible embodiments along with the full scopeof equivalents to which such claims are entitled. Accordingly, theclaims are not limited by the disclosure.

The invention claimed is:
 1. A microfluidic component, comprising: amicrofluidic die having a first number of electrical contacts; and asupport substrate, the microfluidic die coupled to the supportsubstrate, the support substrate including: a second number ofelectrical contacts; a third number of electrical contacts electricallyconnected to the first number of electrical contacts of the microfluidicdie; and a plurality of traces, each of the plurality of traceselectrically connected to one of the second number of electricalcontacts and at least two of the third number of electrical contacts. 2.The microfluidic component of claim 1 wherein the second number ofelectrical contacts is less than the first number of electricalcontacts.
 3. The microfluidic component of claim 2 wherein the secondnumber of electrical contacts are configured to receive drive signalsthat are transmitted to the microfluidic die through the plurality oftraces, through the third number of electrical contacts and through thefirst number of electrical contacts.
 4. The microfluidic component ofclaim 1 wherein the support substrate is a printed circuit board.
 5. Themicrofluidic component of claim 1 wherein the microfluidic die ispositioned at a first end of the support substrate and the second numberof electrical contacts are positioned at a second end of the supportsubstrate opposite the first end of the support substrate.
 6. Themicrofluidic component of claim 5 wherein the support substrate includesan opening at the first end of the support substrate aligned with aninlet path into the microfluidic die.
 7. The microfluidic component ofclaim 5, further comprising a plurality of wires coupled between thefirst number of electrical contacts of the microfluidic die and thethird number of electrical contacts of the substrate.
 8. Themicrofluidic component of claim 7 wherein the plurality of wires extendfrom one side of the die, the one side of the die being positionedbetween nozzles of the die and the second end of the support substrate.9. The microfluidic component of claim 8, further comprising anencapsulant positioned over the wires.
 10. A microfluidic component,comprising: a microfluidic die having a first number of electricalcontacts; and a support substrate, the microfluidic die on the supportsubstrate, the support substrate including: a second number ofelectrical contacts, at least two of the first number of electricalcontacts electrically connected to each of the second number ofelectrical contacts; and a third number of electrical contactselectrically connected between the first number of electrical contactsand the second number of electrical contacts, the third number ofelectrical contacts being greater than or equal to the second number ofelectrical contacts.
 11. The microfluidic component of claim 10 whereinthe microfluidic die is positioned at a first end of the supportsubstrate and the second number of electrical contacts are positioned ata second end of the support substrate.
 12. The microfluidic component ofclaim 11, further comprising a notch in the second end of the supportsubstrate.
 13. The microfluidic component of claim 12 wherein the notchis positioned between groups of the second number of electricalcontacts.
 14. The microfluidic component of claim 10, further comprisinga plurality of wires coupled between the third number of electricalcontacts and the second number of electrical contacts, pairs of theplurality of wires being electrically connected between pairs of thethird number of electrical contacts and one of the second number ofelectrical contacts.
 15. The microfluidic component of claim 10 whereinthe support substrate further comprises: a plurality of traces, each ofthe plurality of traces electrically connected to one of the secondnumber of electrical contacts and at least two of the third number ofelectrical contacts.
 16. A microfluidic component, comprising: amicrofluidic die having a first number of contact pads; a supportsubstrate, the microfluidic die on the support substrate, the supportsubstrate including: a second number of contact pads, each of the secondnumber of contact pads electrically connected to one of the first numberof contact pads; and a third number of contact pads, each of the thirdnumber of contact pads electrically connected to at least two of thesecond number of contact pads.
 17. The microfluidic component of claim16 wherein the first number of contact pads are all positioned on oneside of the microfluidic die.
 18. The microfluidic component of claim 16wherein the support substrate includes an opening aligned with an inletpath of the microfluidic die.
 19. The microfluidic component of claim 16wherein the support substrate includes a circular hole and an ovalshaped hole though the substrate.
 20. The microfluidic component ofclaim 16 wherein the support substrate further comprises: a plurality oftraces, each of the plurality of traces connected to one of the thirdnumber of contact pads and at least two of the second number of contactpads.